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W25Q128FVEIP Datasheet

W25Q128FVEIP Cover
DatasheetW25Q128FVEIP
File Size1,336.79 KB
Total Pages100
ManufacturerWinbond Electronics
Website
Total PartsThis datasheet covers 3 part numbers
Associated Parts W25Q128FVEIP, W25Q128FVCIP, W25Q128FVBIP
Description IC FLASH 128M SPI 104MHZ 8WSON, IC FLASH 128M SPI 24TFBGA, IC FLASH 128M SPI 24TFBGA

W25Q128FVEIP - Winbond Electronics

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URL Link

W25Q128FVEIP

Winbond Electronics

Manufacturer

Winbond Electronics

Series

SpiFlash®

Memory Type

Non-Volatile

Memory Format

FLASH

Technology

FLASH - NOR

Memory Size

128Mb (16M x 8)

Memory Interface

SPI - Quad I/O, QPI

Clock Frequency

104MHz

Write Cycle Time - Word, Page

50µs, 3ms

Access Time

-

Voltage - Supply

2.7V ~ 3.6V

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

8-WDFN Exposed Pad

Supplier Device Package

8-WSON (8x6)

W25Q128FVCIP

Winbond Electronics

Manufacturer

Winbond Electronics

Series

SpiFlash®

Memory Type

Non-Volatile

Memory Format

FLASH

Technology

FLASH - NOR

Memory Size

128Mb (16M x 8)

Memory Interface

SPI - Quad I/O, QPI

Clock Frequency

104MHz

Write Cycle Time - Word, Page

50µs, 3ms

Access Time

-

Voltage - Supply

2.7V ~ 3.6V

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

24-TBGA

Supplier Device Package

24-TFBGA (6x8)

W25Q128FVBIP

Winbond Electronics

Manufacturer

Winbond Electronics

Series

SpiFlash®

Memory Type

Non-Volatile

Memory Format

FLASH

Technology

FLASH - NOR

Memory Size

128Mb (16M x 8)

Memory Interface

SPI - Quad I/O, QPI

Clock Frequency

104MHz

Write Cycle Time - Word, Page

50µs, 3ms

Access Time

-

Voltage - Supply

2.7V ~ 3.6V

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

24-TBGA

Supplier Device Package

24-TFBGA (6x8)