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| Datasheet | SPC5775EDK3MME3R |
| File Size | 908.24 KB |
| Total Pages | 81 |
| Manufacturer | NXP |
| Website | |
| Total Parts | This datasheet covers 3 part numbers |
| Associated Parts | SPC5775EDK3MME3R, SPC5775EDK3MME3, SPC5775BDK3MME2 |
| Description | IC MCU 32BIT 4MB FLASH 416MAPBGA, IC MCU 32BIT 4MB FLASH 416MAPBGA, IC MCU 32BIT 4MB FLASH 416MAPBGA |
SPC5775EDK3MME3R - NXP
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Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z7 Core Size 32-Bit Dual-Core Speed 264MHz Connectivity CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals DMA, LVD, POR, Zipwire Number of I/O 293 Program Memory Size 4MB (4M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 40x12b eQADCx2 Oscillator Type External Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 416-BGA Supplier Device Package 416-MAPBGA (27x27) |
Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z7 Core Size 32-Bit Dual-Core Speed 264MHz Connectivity CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals DMA, LVD, POR, Zipwire Number of I/O 293 Program Memory Size 4MB (4M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 40x12b eQADCx2 Oscillator Type External Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 416-BGA Supplier Device Package 416-MAPBGA (27x27) |
Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z7 Core Size 32-Bit Dual-Core Speed 220MHz Connectivity CANbus, EBI/EMI, Ethernet, FlexCANbus, LINbus, SCI, SPI Peripherals DMA, LVD, POR, Zipwire Number of I/O 293 Program Memory Size 4MB (4M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 40x12b eQADCx2 Oscillator Type External Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 416-BGA Supplier Device Package 416-MAPBGA (27x27) |