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SPC5747CFK0AMKU6 - NXP
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Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z2, e200z4 Core Size 32-Bit Dual-Core Speed 80MHz/160MHz Connectivity CANbus, Ethernet, I²C, LINbus, SAI, SPI Peripherals DMA, LVD, POR, WDT Number of I/O 129 Program Memory Size 4MB (4M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 80x10b, 64x12b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 176-LQFP Exposed Pad Supplier Device Package 176-LQFP (24x24) |
Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z2, e200z4 Core Size 32-Bit Dual-Core Speed 80MHz/160MHz Connectivity CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals DMA, LVD, POR, WDT Number of I/O 178 Program Memory Size 3MB (3M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 80x10b, 64x12b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 256-LBGA Supplier Device Package 256-MAPPBGA (17x17) |
Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z2, e200z4 Core Size 32-Bit Dual-Core Speed 80MHz/160MHz Connectivity CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals DMA, LVD, POR, WDT Number of I/O 178 Program Memory Size 3MB (3M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 80x10b, 64x12b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 256-LBGA Supplier Device Package 256-MAPPBGA (17x17) |
Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z2, e200z4 Core Size 32-Bit Dual-Core Speed 80MHz/160MHz Connectivity CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals DMA, LVD, POR, WDT Number of I/O 129 Program Memory Size 3MB (3M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 80x10b, 64x12b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 176-LQFP Exposed Pad Supplier Device Package 176-LQFP (24x24) |
Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z2, e200z4 Core Size 32-Bit Dual-Core Speed 80MHz/160MHz Connectivity CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals DMA, LVD, POR, WDT Number of I/O 129 Program Memory Size 3MB (3M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 80x10b, 64x12b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 176-LQFP Exposed Pad Supplier Device Package 176-LQFP (24x24) |
Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z2, e200z4 Core Size 32-Bit Dual-Core Speed 80MHz/160MHz Connectivity CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals DMA, LVD, POR, WDT Number of I/O 178 Program Memory Size 3MB (3M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 80x10b, 64x12b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 256-LBGA Supplier Device Package 256-MAPPBGA (17x17) |
Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z2, e200z4 Core Size 32-Bit Dual-Core Speed 80MHz/160MHz Connectivity CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals DMA, LVD, POR, WDT Number of I/O 129 Program Memory Size 3MB (3M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 80x10b, 64x12b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 176-LQFP Exposed Pad Supplier Device Package 176-LQFP (24x24) |
Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z2, e200z4 Core Size 32-Bit Dual-Core Speed 80MHz/160MHz Connectivity CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals DMA, LVD, POR, WDT Number of I/O 129 Program Memory Size 3MB (3M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 80x10b, 64x12b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 176-LQFP Exposed Pad Supplier Device Package 176-LQFP (24x24) |
Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z4 Core Size 32-Bit Speed 160MHz Connectivity CANbus, Ethernet, FlexRay, I²C, LINbus, SPI Peripherals DMA, I²S, POR, WDT Number of I/O 129 Program Memory Size 3MB (3M x 8) Program Memory Type FLASH EEPROM Size 64K x 8 RAM Size 384K x 8 Voltage - Supply (Vcc/Vdd) 3.15V ~ 5.5V Data Converters A/D 36x10b, 16x12b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 176-LQFP Exposed Pad Supplier Device Package 176-LQFP (24x24) |
Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z2, e200z4 Core Size 32-Bit Dual-Core Speed 80MHz/160MHz Connectivity CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals DMA, LVD, POR, WDT Number of I/O 178 Program Memory Size 3MB (3M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 80x10b, 64x12b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 256-LBGA Supplier Device Package 256-MAPPBGA (17x17) |
Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z2, e200z4 Core Size 32-Bit Dual-Core Speed 80MHz/160MHz Connectivity CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals DMA, LVD, POR, WDT Number of I/O - Program Memory Size 3MB (3M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 80x10b, 64x12b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 100-LBGA Supplier Device Package 100-MAPBGA (11x11) |
Manufacturer NXP USA Inc. Series MPC57xx Core Processor e200z2, e200z4 Core Size 32-Bit Dual-Core Speed 80MHz/160MHz Connectivity CANbus, Ethernet, I²C, LINbus, SAI, SPI, USB, USB OTG Peripherals DMA, LVD, POR, WDT Number of I/O - Program Memory Size 3MB (3M x 8) Program Memory Type FLASH EEPROM Size - RAM Size 512K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 80x10b, 64x12b Oscillator Type Internal Operating Temperature -40°C ~ 125°C (TA) Mounting Type Surface Mount Package / Case 100-LBGA Supplier Device Package 100-MAPBGA (11x11) |