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| Datasheet | MCIMX6L7DVN10AA |
| File Size | 820.24 KB |
| Total Pages | 104 |
| Manufacturer | NXP |
| Website | |
| Total Parts | This datasheet covers 12 part numbers |
| Associated Parts | MCIMX6L7DVN10AA, MCIMX6L3EVN10AA, MCIMX6L3DVN10AA, MCIMX6L2EVN10AA, MCIMX6L2DVN10AA, MCIMX6L8DVN10AA, MCIMX6L7DVN10AB, MCIMX6L3EVN10AB, MCIMX6L3DVN10AB, MCIMX6L8DVN10AB, MCIMX6L2DVN10AB, MCIMX6L2EVN10AB |
| Description | IC MPU I.MX6SL 1.0GHZ 432MAPBGA, IC MPU I.MX6SL 1.0GHZ 432MAPBGA, IC MPU I.MX6SL 1.0GHZ 432MAPBGA, IC MPU I.MX6SL 1.0GHZ 432MAPBGA, IC MPU I.MX6SL 1.0GHZ 432MAPBGA |
MCIMX6L7DVN10AA - NXP
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Manufacturer NXP USA Inc. Series i.MX6SL Core Processor ARM® Cortex®-A9 Number of Cores/Bus Width 1 Core, 32-Bit Speed 1.0GHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR2, LVDDR3, DDR3 Graphics Acceleration Yes Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 + PHY (3) Voltage - I/O 1.2V, 1.8V, 3.0V Operating Temperature 0°C ~ 95°C (TJ) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case 432-TFBGA Supplier Device Package 432-MAPBGA (13x13) |
Manufacturer NXP USA Inc. Series i.MX6SL Core Processor ARM® Cortex®-A9 Number of Cores/Bus Width 1 Core, 32-Bit Speed 1.0GHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR2, LVDDR3, DDR3 Graphics Acceleration Yes Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 + PHY (3) Voltage - I/O 1.2V, 1.8V, 3.0V Operating Temperature -40°C ~ 105°C (TA) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case 432-TFBGA Supplier Device Package 432-MAPBGA (13x13) |
Manufacturer NXP USA Inc. Series i.MX6SL Core Processor ARM® Cortex®-A9 Number of Cores/Bus Width 1 Core, 32-Bit Speed 1.0GHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR2, LVDDR3, DDR3 Graphics Acceleration Yes Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 + PHY (3) Voltage - I/O 1.2V, 1.8V, 3.0V Operating Temperature 0°C ~ 95°C (TJ) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case 432-TFBGA Supplier Device Package 432-MAPBGA (13x13) |
Manufacturer NXP USA Inc. Series i.MX6SL Core Processor ARM® Cortex®-A9 Number of Cores/Bus Width 1 Core, 32-Bit Speed 1.0GHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR2, LVDDR3, DDR3 Graphics Acceleration Yes Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 + PHY (3) Voltage - I/O 1.2V, 1.8V, 3.0V Operating Temperature -40°C ~ 105°C (TA) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case 432-TFBGA Supplier Device Package 432-MAPBGA (13x13) |
Manufacturer NXP USA Inc. Series i.MX6SL Core Processor ARM® Cortex®-A9 Number of Cores/Bus Width 1 Core, 32-Bit Speed 1.0GHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR2, LVDDR3, DDR3 Graphics Acceleration Yes Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 + PHY (3) Voltage - I/O 1.2V, 1.8V, 3.0V Operating Temperature 0°C ~ 95°C (TJ) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case 432-TFBGA Supplier Device Package 432-MAPBGA (13x13) |
Manufacturer NXP USA Inc. Series i.MX6SL Core Processor ARM® Cortex®-A9 Number of Cores/Bus Width 1 Core, 32-Bit Speed 1.0GHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR2, LVDDR3, DDR3 Graphics Acceleration Yes Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 + PHY (3) Voltage - I/O 1.2V, 1.8V, 3.0V Operating Temperature 0°C ~ 95°C (TJ) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case 432-TFBGA Supplier Device Package 432-MAPBGA (13x13) |
Manufacturer NXP USA Inc. Series i.MX6SL Core Processor ARM® Cortex®-A9 Number of Cores/Bus Width 1 Core, 32-Bit Speed 1.0GHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR2, LVDDR3, DDR3 Graphics Acceleration Yes Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 + PHY (3) Voltage - I/O 1.2V, 1.8V, 3.0V Operating Temperature 0°C ~ 95°C (TJ) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case 432-TFBGA Supplier Device Package 432-MAPBGA (13x13) |
Manufacturer NXP USA Inc. Series i.MX6SL Core Processor ARM® Cortex®-A9 Number of Cores/Bus Width 1 Core, 32-Bit Speed 1.0GHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR2, LVDDR3, DDR3 Graphics Acceleration Yes Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 + PHY (3) Voltage - I/O 1.2V, 1.8V, 3.0V Operating Temperature -40°C ~ 105°C (TA) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case 432-TFBGA Supplier Device Package 432-MAPBGA (13x13) |
Manufacturer NXP USA Inc. Series i.MX6SL Core Processor ARM® Cortex®-A9 Number of Cores/Bus Width 1 Core, 32-Bit Speed 1.0GHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR2, LVDDR3, DDR3 Graphics Acceleration Yes Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 + PHY (3) Voltage - I/O 1.2V, 1.8V, 3.0V Operating Temperature 0°C ~ 95°C (TJ) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case 432-TFBGA Supplier Device Package 432-MAPBGA (13x13) |
Manufacturer NXP USA Inc. Series i.MX6SL Core Processor ARM® Cortex®-A9 Number of Cores/Bus Width 1 Core, 32-Bit Speed 1.0GHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR2, LVDDR3, DDR3 Graphics Acceleration Yes Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 + PHY (3) Voltage - I/O 1.2V, 1.8V, 3.0V Operating Temperature 0°C ~ 95°C (TJ) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case 432-TFBGA Supplier Device Package 432-MAPBGA (13x13) |
Manufacturer NXP USA Inc. Series i.MX6SL Core Processor ARM® Cortex®-A9 Number of Cores/Bus Width 1 Core, 32-Bit Speed 1.0GHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR2, LVDDR3, DDR3 Graphics Acceleration Yes Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 + PHY (3) Voltage - I/O 1.2V, 1.8V, 3.0V Operating Temperature 0°C ~ 95°C (TJ) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case 432-TFBGA Supplier Device Package 432-MAPBGA (13x13) |
Manufacturer NXP USA Inc. Series i.MX6SL Core Processor ARM® Cortex®-A9 Number of Cores/Bus Width 1 Core, 32-Bit Speed 1.0GHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR2, LVDDR3, DDR3 Graphics Acceleration Yes Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 + PHY (3) Voltage - I/O 1.2V, 1.8V, 3.0V Operating Temperature -40°C ~ 105°C (TA) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection Package / Case 432-TFBGA Supplier Device Package 432-MAPBGA (13x13) |