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| Datasheet | MCIMX515DJZK8C |
| File Size | 3,907.88 KB |
| Total Pages | 202 |
| Manufacturer | NXP |
| Website | |
| Total Parts | This datasheet covers 15 part numbers |
| Associated Parts | MCIMX515DJZK8C, MCIMX513DJM8CR2, MCIMX513CJM6CR2, MCIMX512DJM8CR2, PCIMX515DJM8C, MCIMX515CJM6C, MCIMX512CJM6C, MCIMX515CJM6CR2, MCIMX512CJM6CR2, MCIMX513DJM8C, MCIMX515DJM8CR2, MCIMX513CJM6C, MCIMX515DVK8C, MCIMX515DJM8C, MCIMX512DJM8C |
| Description | IC MPU I.MX51 800MHZ 529BGA, IC MPU I.MX51 800MHZ 529BGA, IC MPU I.MX51 600MHZ 529BGA, IC MPU I.MX51 800MHZ 529BGA, IC MPU I.MX51 800MHZ 529MAPBGA |
MCIMX515DJZK8C - NXP
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Manufacturer NXP USA Inc. Series i.MX51 Core Processor ARM® Cortex®-A8 Number of Cores/Bus Width 1 Core, 32-Bit Speed 800MHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR, DDR2 Graphics Acceleration Yes Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature -20°C ~ 85°C (TC) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Package / Case 527-TFBGA Supplier Device Package 527-BGA (13x13) |
Manufacturer NXP USA Inc. Series i.MX51 Core Processor ARM® Cortex®-A8 Number of Cores/Bus Width 1 Core, 32-Bit Speed 800MHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR, DDR2 Graphics Acceleration No Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature -20°C ~ 85°C (TC) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Package / Case 529-LFBGA Supplier Device Package 529-BGA (19x19) |
Manufacturer NXP USA Inc. Series i.MX51 Core Processor ARM® Cortex®-A8 Number of Cores/Bus Width 1 Core, 32-Bit Speed 600MHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR, DDR2 Graphics Acceleration No Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature -40°C ~ 95°C (TC) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Package / Case 529-LFBGA Supplier Device Package 529-BGA (19x19) |
Manufacturer NXP USA Inc. Series i.MX51 Core Processor ARM® Cortex®-A8 Number of Cores/Bus Width 1 Core, 32-Bit Speed 800MHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR, DDR2 Graphics Acceleration No Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature -20°C ~ 85°C (TC) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Package / Case 529-LFBGA Supplier Device Package 529-BGA (19x19) |
Manufacturer NXP USA Inc. Series i.MX51 Core Processor ARM® Cortex®-A8 Number of Cores/Bus Width 1 Core, 32-Bit Speed 800MHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR, DDR2 Graphics Acceleration Yes Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature -20°C ~ 85°C (TC) Security Features Boot Security, Cryptography, Hardware ID, RTIC, Secure JTAG Package / Case 529-LFBGA Supplier Device Package 529-BGA (19x19) |
Manufacturer NXP USA Inc. Series i.MX51 Core Processor ARM® Cortex®-A8 Number of Cores/Bus Width 1 Core, 32-Bit Speed 600MHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR, DDR2 Graphics Acceleration Yes Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature -40°C ~ 95°C (TC) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Package / Case 529-LFBGA Supplier Device Package 529-BGA (19x19) |
Manufacturer NXP USA Inc. Series i.MX51 Core Processor ARM® Cortex®-A8 Number of Cores/Bus Width 1 Core, 32-Bit Speed 600MHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR, DDR2 Graphics Acceleration No Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature -40°C ~ 95°C (TC) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Package / Case 529-LFBGA Supplier Device Package 529-BGA (19x19) |
Manufacturer NXP USA Inc. Series i.MX51 Core Processor ARM® Cortex®-A8 Number of Cores/Bus Width 1 Core, 32-Bit Speed 600MHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR, DDR2 Graphics Acceleration Yes Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature -40°C ~ 95°C (TC) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Package / Case 529-LFBGA Supplier Device Package 529-BGA (19x19) |
Manufacturer NXP USA Inc. Series i.MX51 Core Processor ARM® Cortex®-A8 Number of Cores/Bus Width 1 Core, 32-Bit Speed 600MHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR, DDR2 Graphics Acceleration No Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature -40°C ~ 95°C (TC) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Package / Case 529-LFBGA Supplier Device Package 529-BGA (19x19) |
Manufacturer NXP USA Inc. Series i.MX51 Core Processor ARM® Cortex®-A8 Number of Cores/Bus Width 1 Core, 32-Bit Speed 800MHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR, DDR2 Graphics Acceleration No Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature -20°C ~ 85°C (TC) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Package / Case 529-LFBGA Supplier Device Package 529-BGA (19x19) |
Manufacturer NXP USA Inc. Series i.MX51 Core Processor ARM® Cortex®-A8 Number of Cores/Bus Width 1 Core, 32-Bit Speed 800MHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR, DDR2 Graphics Acceleration Yes Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature -20°C ~ 85°C (TC) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Package / Case 529-LFBGA Supplier Device Package 529-BGA (19x19) |
Manufacturer NXP USA Inc. Series i.MX51 Core Processor ARM® Cortex®-A8 Number of Cores/Bus Width 1 Core, 32-Bit Speed 600MHz Co-Processors/DSP Multimedia; NEON™ SIMD RAM Controllers LPDDR, DDR2 Graphics Acceleration No Display & Interface Controllers Keypad, LCD Ethernet 10/100Mbps (1) SATA - USB USB 2.0 (3), USB 2.0 + PHY (1) Voltage - I/O 1.2V, 1.875V, 2.775V, 3.0V Operating Temperature -40°C ~ 95°C (TC) Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC Package / Case 529-LFBGA Supplier Device Package 529-BGA (19x19) |