Semiconductors
Passive Components
Sensors
Power
Optoelectronics
| Datasheet | MCHC11F1CFNE5 |
| File Size | 1,753.54 KB |
| Total Pages | 158 |
| Manufacturer | NXP |
| Website | |
| Total Parts | This datasheet covers 15 part numbers |
| Associated Parts | MCHC11F1CFNE5, MC68HC11F1CFN2, MC68HC11F1CFN3, MC68HC11F1CFN4, MC68HC11F1CPU4, MC68HC11F1CFN3R2, MC68HC11F1CFN4R2, MCHC11F1VFNE3, MC68L11F1CFNE3, MCHC11F1CFNE4R, MCHC11F1CFNE3R, MCHC11F1CFNE2R, MCHC11F1CFNE3, MCHC11F1CFNE2, MCHC11F1CFNE4 |
| Description | IC MCU 8BIT ROMLESS 68PLCC, IC MCU 8BIT ROMLESS 68PLCC, IC MCU 8BIT ROMLESS 68PLCC, IC MCU 8BIT ROMLESS 68PLCC, IC MCU 8BIT ROMLESS 80LQFP |
MCHC11F1CFNE5 - NXP
The Products You May Be Interested In
 |
MCHC11F1CFNE5 | NXP | IC MCU 8BIT ROMLESS 68PLCC | 433 More on Order |
 |
MC68HC11F1CFN2 | NXP | IC MCU 8BIT ROMLESS 68PLCC | 321 More on Order |
 |
MC68HC11F1CFN3 | NXP | IC MCU 8BIT ROMLESS 68PLCC | 583 More on Order |
 |
MC68HC11F1CFN4 | NXP | IC MCU 8BIT ROMLESS 68PLCC | 460 More on Order |
 |
MC68HC11F1CPU4 | NXP | IC MCU 8BIT ROMLESS 80LQFP | 458 More on Order |
 |
MC68HC11F1CFN3R2 | NXP | IC MCU 8BIT ROMLESS 68PLCC | 306 More on Order |
 |
MC68HC11F1CFN4R2 | NXP | IC MCU 8BIT ROMLESS 68PLCC | 126 More on Order |
 |
MCHC11F1VFNE3 | NXP | IC MCU 8BIT ROMLESS 68PLCC | 456 More on Order |
 |
MC68L11F1CFNE3 | NXP | IC MCU 8BIT ROMLESS 68PLCC | 470 More on Order |
 |
MCHC11F1CFNE4R | NXP | IC MCU 8BIT ROMLESS 68PLCC | 406 More on Order |
 |
MCHC11F1CFNE3R | NXP | IC MCU 8BIT ROMLESS 68PLCC | 596 More on Order |
 |
MCHC11F1CFNE2R | NXP | IC MCU 8BIT ROMLESS 68PLCC | 500 More on Order |
URL Link
|
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 5MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 30 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 4.75V ~ 5.25V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 68-LCC (J-Lead) Supplier Device Package 68-PLCC (24.21x24.21) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 2MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 30 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 4.75V ~ 5.25V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 68-LCC (J-Lead) Supplier Device Package 68-PLCC (24.21x24.21) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 30 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 4.75V ~ 5.25V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 68-LCC (J-Lead) Supplier Device Package 68-PLCC (24.21x24.21) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 4MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 30 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 4.75V ~ 5.25V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 68-LCC (J-Lead) Supplier Device Package 68-PLCC (24.21x24.21) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 4MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 30 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 4.75V ~ 5.25V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 80-QFP Supplier Device Package 80-LQFP (14x14) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 30 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 4.75V ~ 5.25V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 68-LCC (J-Lead) Supplier Device Package 68-PLCC (24.21x24.21) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 4MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 30 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 4.75V ~ 5.25V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 68-LCC (J-Lead) Supplier Device Package 68-PLCC (24.21x24.21) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 30 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 4.75V ~ 5.25V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 105°C (TA) Mounting Type Surface Mount Package / Case 68-LCC (J-Lead) Supplier Device Package 68-PLCC (24.21x24.21) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 30 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 3V ~ 5.5V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 68-LCC (J-Lead) Supplier Device Package 68-PLCC (24.21x24.21) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 4MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 30 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 4.75V ~ 5.25V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 68-LCC (J-Lead) Supplier Device Package 68-PLCC (24.21x24.21) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 3MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 30 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 4.75V ~ 5.25V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 68-LCC (J-Lead) Supplier Device Package 68-PLCC (24.21x24.21) |
Manufacturer NXP USA Inc. Series HC11 Core Processor HC11 Core Size 8-Bit Speed 2MHz Connectivity SCI, SPI Peripherals POR, WDT Number of I/O 30 Program Memory Size - Program Memory Type ROMless EEPROM Size 512 x 8 RAM Size 1K x 8 Voltage - Supply (Vcc/Vdd) 4.75V ~ 5.25V Data Converters A/D 8x8b Oscillator Type Internal Operating Temperature -40°C ~ 85°C (TA) Mounting Type Surface Mount Package / Case 68-LCC (J-Lead) Supplier Device Package 68-PLCC (24.21x24.21) |