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MC68HC11E1VFNE3 Datasheet

MC68HC11E1VFNE3 Cover

MC68HC11E1VFNE3 - NXP

MC68HC11E1VFNE3 Datasheet Page 1
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URL Link

Manufacturer

NXP USA Inc.

Series

HC11

Core Processor

HC11

Core Size

8-Bit

Speed

3MHz

Connectivity

SCI, SPI

Peripherals

POR, WDT

Number of I/O

38

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

512 x 8

RAM Size

512 x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 8x8b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 105°C (TA)

Mounting Type

Surface Mount

Package / Case

52-LCC (J-Lead)

Supplier Device Package

52-PLCC (19.1x19.1)

Manufacturer

NXP USA Inc.

Series

HC11

Core Processor

HC11

Core Size

8-Bit

Speed

2MHz

Connectivity

SCI, SPI

Peripherals

POR, WDT

Number of I/O

38

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

512 x 8

RAM Size

512 x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 8x8b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

52-LCC (J-Lead)

Supplier Device Package

52-PLCC (19.1x19.1)

Manufacturer

NXP USA Inc.

Series

HC11

Core Processor

HC11

Core Size

8-Bit

Speed

2MHz

Connectivity

SCI, SPI

Peripherals

POR, WDT

Number of I/O

38

Program Memory Size

12KB (12K x 8)

Program Memory Type

OTP

EEPROM Size

512 x 8

RAM Size

512 x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 5.5V

Data Converters

A/D 8x8b

Oscillator Type

Internal

Operating Temperature

0°C ~ 70°C (TA)

Mounting Type

Surface Mount

Package / Case

52-LCC (J-Lead)

Supplier Device Package

52-PLCC (19.1x19.1)

Manufacturer

NXP USA Inc.

Series

HC11

Core Processor

HC11

Core Size

8-Bit

Speed

2MHz

Connectivity

SCI, SPI

Peripherals

POR, WDT

Number of I/O

38

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

512 x 8

RAM Size

512 x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 8x8b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 105°C (TA)

Mounting Type

Surface Mount

Package / Case

52-LCC (J-Lead)

Supplier Device Package

52-PLCC (19.1x19.1)

Manufacturer

NXP USA Inc.

Series

HC11

Core Processor

HC11

Core Size

8-Bit

Speed

2MHz

Connectivity

SCI, SPI

Peripherals

POR, WDT

Number of I/O

38

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

512 x 8

RAM Size

512 x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 8x8b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

52-LCC (J-Lead)

Supplier Device Package

52-PLCC (19.1x19.1)

Manufacturer

NXP USA Inc.

Series

HC11

Core Processor

HC11

Core Size

8-Bit

Speed

2MHz

Connectivity

SCI, SPI

Peripherals

POR, WDT

Number of I/O

38

Program Memory Size

20KB (20K x 8)

Program Memory Type

OTP

EEPROM Size

512 x 8

RAM Size

768 x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 8x8b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

64-QFP

Supplier Device Package

64-QFP (14x14)

Manufacturer

NXP USA Inc.

Series

HC11

Core Processor

HC11

Core Size

8-Bit

Speed

3MHz

Connectivity

SCI, SPI

Peripherals

POR, WDT

Number of I/O

38

Program Memory Size

20KB (20K x 8)

Program Memory Type

OTP

EEPROM Size

512 x 8

RAM Size

768 x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 8x8b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

64-QFP

Supplier Device Package

64-QFP (14x14)

Manufacturer

NXP USA Inc.

Series

HC11

Core Processor

HC11

Core Size

8-Bit

Speed

3MHz

Connectivity

SCI, SPI

Peripherals

POR, WDT

Number of I/O

38

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

512 x 8

RAM Size

512 x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 8x8b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

52-LCC (J-Lead)

Supplier Device Package

52-PLCC (19.1x19.1)

Manufacturer

NXP USA Inc.

Series

HC11

Core Processor

HC11

Core Size

8-Bit

Speed

3MHz

Connectivity

SCI, SPI

Peripherals

POR, WDT

Number of I/O

38

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

-

RAM Size

512 x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 8x8b

Oscillator Type

Internal

Operating Temperature

0°C ~ 70°C (TA)

Mounting Type

Surface Mount

Package / Case

52-LCC (J-Lead)

Supplier Device Package

52-PLCC (19.1x19.1)

Manufacturer

NXP USA Inc.

Series

HC11

Core Processor

HC11

Core Size

8-Bit

Speed

2MHz

Connectivity

SCI, SPI

Peripherals

POR, WDT

Number of I/O

38

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

512 x 8

RAM Size

512 x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 8x8b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

52-LQFP

Supplier Device Package

52-TQFP (10x10)

Manufacturer

NXP USA Inc.

Series

HC11

Core Processor

HC11

Core Size

8-Bit

Speed

2MHz

Connectivity

SCI, SPI

Peripherals

POR, WDT

Number of I/O

38

Program Memory Size

12KB (12K x 8)

Program Memory Type

OTP

EEPROM Size

512 x 8

RAM Size

512 x 8

Voltage - Supply (Vcc/Vdd)

4.5V ~ 5.5V

Data Converters

A/D 8x8b

Oscillator Type

External

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

52-LCC (J-Lead)

Supplier Device Package

52-PLCC (19.1x19.1)

Manufacturer

NXP USA Inc.

Series

HC11

Core Processor

HC11

Core Size

8-Bit

Speed

2MHz

Connectivity

SCI, SPI

Peripherals

POR, WDT

Number of I/O

38

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

512 x 8

RAM Size

512 x 8

Voltage - Supply (Vcc/Vdd)

3V ~ 5.5V

Data Converters

A/D 8x8b

Oscillator Type

Internal

Operating Temperature

0°C ~ 70°C (TA)

Mounting Type

Surface Mount

Package / Case

52-LCC (J-Lead)

Supplier Device Package

52-PLCC (19.1x19.1)