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LPC2290FBD144 Datasheet

LPC2290FBD144,551 Cover
DatasheetLPC2290FBD144,551
File Size198.51 KB
Total Pages41
ManufacturerNXP
Website
Total PartsThis datasheet covers 2 part numbers
Associated Parts LPC2290FBD144,551, LPC2290FBD144/01,5
Description IC MCU 16/32BIT ROMLESS 144LQFP, IC MCU 16/32BIT ROMLESS 144LQFP

LPC2290FBD144,551 - NXP

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URL Link

Manufacturer

NXP USA Inc.

Series

LPC2200

Core Processor

ARM7®

Core Size

16/32-Bit

Speed

60MHz

Connectivity

CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART

Peripherals

PWM, WDT

Number of I/O

76

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

-

RAM Size

16K x 8

Voltage - Supply (Vcc/Vdd)

1.65V ~ 3.6V

Data Converters

A/D 8x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

144-LQFP

Supplier Device Package

144-LQFP (20x20)

Manufacturer

NXP USA Inc.

Series

LPC2200

Core Processor

ARM7®

Core Size

16/32-Bit

Speed

60MHz

Connectivity

CANbus, EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART

Peripherals

PWM, WDT

Number of I/O

76

Program Memory Size

-

Program Memory Type

ROMless

EEPROM Size

-

RAM Size

64K x 8

Voltage - Supply (Vcc/Vdd)

1.65V ~ 3.6V

Data Converters

A/D 8x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

144-LQFP

Supplier Device Package

144-LQFP (20x20)