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LPC11A11FHN33/001 Datasheet

LPC11A11FHN33/001, Cover
DatasheetLPC11A11FHN33/001,
File Size1,761.2 KB
Total Pages84
ManufacturerNXP
Website
Total PartsThis datasheet covers 8 part numbers
Associated Parts LPC11A11FHN33/001,, LPC11A04UK,118, LPC11A14FBD48/301,, LPC11A02UK,118, LPC11A14FHN33/301,, LPC11A13FHI33/201,, LPC11A12FBD48/101,, LPC11A12FHN33/101,
Description IC MCU 32BIT 8KB FLASH 32HVQFN, IC MCU 32BIT 32KB FLASH 20WLCSP, IC MCU 32BIT 32KB FLASH 48LQFP, IC MCU 32BIT 16KB FLASH 20WLCSP, IC MCU 32BIT 32KB FLASH 32HVQFN

LPC11A11FHN33/001, - NXP

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URL Link

Manufacturer

NXP USA Inc.

Series

LPC11Axx

Core Processor

ARM® Cortex®-M0

Core Size

32-Bit

Speed

50MHz

Connectivity

I²C, Microwire, SPI, SSI, SSP, UART/USART

Peripherals

Brown-out Detect/Reset, POR, WDT

Number of I/O

28

Program Memory Size

8KB (8K x 8)

Program Memory Type

FLASH

EEPROM Size

512 x 8

RAM Size

2K x 8

Voltage - Supply (Vcc/Vdd)

2.6V ~ 3.6V

Data Converters

A/D 8x10b; D/A 1x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

32-VQFN Exposed Pad

Supplier Device Package

32-HVQFN (7x7)

Manufacturer

NXP USA Inc.

Series

LPC11Axx

Core Processor

ARM® Cortex®-M0

Core Size

32-Bit

Speed

50MHz

Connectivity

I²C, Microwire, SPI, SSI, SSP, UART/USART

Peripherals

Brown-out Detect/Reset, POR, WDT

Number of I/O

18

Program Memory Size

32KB (32K x 8)

Program Memory Type

FLASH

EEPROM Size

4K x 8

RAM Size

8K x 8

Voltage - Supply (Vcc/Vdd)

2.6V ~ 3.6V

Data Converters

A/D 8x10b; D/A 1x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

20-UFBGA, WLCSP

Supplier Device Package

20-WLCSP (2.55x2.55)

Manufacturer

NXP USA Inc.

Series

LPC11Axx

Core Processor

ARM® Cortex®-M0

Core Size

32-Bit

Speed

50MHz

Connectivity

I²C, Microwire, SPI, SSI, SSP, UART/USART

Peripherals

Brown-out Detect/Reset, POR, WDT

Number of I/O

42

Program Memory Size

32KB (32K x 8)

Program Memory Type

FLASH

EEPROM Size

4K x 8

RAM Size

8K x 8

Voltage - Supply (Vcc/Vdd)

2.6V ~ 3.6V

Data Converters

A/D 8x10b; D/A 1x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

48-LQFP

Supplier Device Package

48-LQFP (7x7)

Manufacturer

NXP USA Inc.

Series

LPC11Axx

Core Processor

ARM® Cortex®-M0

Core Size

32-Bit

Speed

50MHz

Connectivity

I²C, Microwire, SPI, SSI, SSP, UART/USART

Peripherals

Brown-out Detect/Reset, POR, WDT

Number of I/O

18

Program Memory Size

16KB (16K x 8)

Program Memory Type

FLASH

EEPROM Size

2K x 8

RAM Size

4K x 8

Voltage - Supply (Vcc/Vdd)

2.6V ~ 3.6V

Data Converters

A/D 8x10b; D/A 1x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

20-UFBGA, WLCSP

Supplier Device Package

20-WLCSP (2.55x2.55)

Manufacturer

NXP USA Inc.

Series

LPC11Axx

Core Processor

ARM® Cortex®-M0

Core Size

32-Bit

Speed

50MHz

Connectivity

I²C, Microwire, SPI, SSI, SSP, UART/USART

Peripherals

Brown-out Detect/Reset, POR, WDT

Number of I/O

28

Program Memory Size

32KB (32K x 8)

Program Memory Type

FLASH

EEPROM Size

4K x 8

RAM Size

8K x 8

Voltage - Supply (Vcc/Vdd)

2.6V ~ 3.6V

Data Converters

A/D 8x10b; D/A 1x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

32-VQFN Exposed Pad

Supplier Device Package

32-HVQFN (7x7)

Manufacturer

NXP USA Inc.

Series

LPC11Axx

Core Processor

ARM® Cortex®-M0

Core Size

32-Bit

Speed

50MHz

Connectivity

I²C, Microwire, SPI, SSI, SSP, UART/USART

Peripherals

Brown-out Detect/Reset, POR, WDT

Number of I/O

28

Program Memory Size

24KB (24K x 8)

Program Memory Type

FLASH

EEPROM Size

2K x 8

RAM Size

6K x 8

Voltage - Supply (Vcc/Vdd)

2.6V ~ 3.6V

Data Converters

A/D 8x10b; D/A 1x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

32-VFQFN Exposed Pad

Supplier Device Package

32-HVQFN (5x5)

Manufacturer

NXP USA Inc.

Series

LPC11Axx

Core Processor

ARM® Cortex®-M0

Core Size

32-Bit

Speed

50MHz

Connectivity

I²C, Microwire, SPI, SSI, SSP, UART/USART

Peripherals

Brown-out Detect/Reset, POR, WDT

Number of I/O

42

Program Memory Size

16KB (16K x 8)

Program Memory Type

FLASH

EEPROM Size

1K x 8

RAM Size

4K x 8

Voltage - Supply (Vcc/Vdd)

2.6V ~ 3.6V

Data Converters

A/D 8x10b; D/A 1x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

48-LQFP

Supplier Device Package

48-LQFP (7x7)

Manufacturer

NXP USA Inc.

Series

LPC11Axx

Core Processor

ARM® Cortex®-M0

Core Size

32-Bit

Speed

50MHz

Connectivity

I²C, Microwire, SPI, SSI, SSP, UART/USART

Peripherals

Brown-out Detect/Reset, POR, WDT

Number of I/O

28

Program Memory Size

16KB (16K x 8)

Program Memory Type

FLASH

EEPROM Size

1K x 8

RAM Size

4K x 8

Voltage - Supply (Vcc/Vdd)

2.6V ~ 3.6V

Data Converters

A/D 8x10b; D/A 1x10b

Oscillator Type

Internal

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

32-VQFN Exposed Pad

Supplier Device Package

32-HVQFN (7x7)