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| Datasheet | DS34S132GN |
| File Size | 4,966.18 KB |
| Total Pages | 194 |
| Manufacturer | Maxim Integrated |
| Website | https://www.maximintegrated.com/ |
| Total Parts | This datasheet covers 3 part numbers |
| Associated Parts | DS34S132GN, DS34S132GNA2+, DS34S132GN+ |
| Description | IC TDM/PACKET TRANSPORT 676BGA, IC TDM PACKET 32PORT 676PBGA, IC TDM OVER PACKET 676-BGA |
DS34S132GN - Maxim Integrated
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Manufacturer Maxim Integrated Series - Function TDM-over-Packet (TDMoP) Interface TDMoP Number of Circuits 1 Voltage - Supply 1.8V, 3.3V Current - Supply - Power (Watts) - Operating Temperature -40°C ~ 85°C Mounting Type Surface Mount Package / Case 676-BGA Supplier Device Package 676-TEPBGA (27x27) |
Manufacturer Maxim Integrated Series - Function TDM-over-Packet (TDMoP) Interface TDMoP Number of Circuits 1 Voltage - Supply 1.8V, 3.3V Current - Supply - Power (Watts) - Operating Temperature -40°C ~ 85°C Mounting Type Surface Mount Package / Case 676-BGA Supplier Device Package 676-TEPBGA (27x27) |
Manufacturer Maxim Integrated Series - Function TDM-over-Packet (TDMoP) Interface TDMoP Number of Circuits 1 Voltage - Supply 1.8V, 3.3V Current - Supply - Power (Watts) - Operating Temperature -40°C ~ 85°C Mounting Type Surface Mount Package / Case 676-BGA Supplier Device Package 676-TEPBGA (27x27) |