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BR25G256-3 Datasheet

BR25G256-3 Cover
DatasheetBR25G256-3
File Size2,223.04 KB
Total Pages34
ManufacturerRohm Semiconductor
Websitehttps://www.rohm.com/
Total PartsThis datasheet covers 3 part numbers
Associated Parts BR25G256-3, BR25G256FVT-3GE2, BR25G256FJ-3GE2
Description IC EEPROM 256K SPI 20MHZ 8DIP, IC EEPROM 256K SPI 20MHZ 8TSSOP, IC EEPROM 256K SPI 20MHZ 8SOPJ

BR25G256-3 - Rohm Semiconductor

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URL Link

BR25G256-3

Rohm Semiconductor

Manufacturer

Rohm Semiconductor

Series

-

Memory Type

Non-Volatile

Memory Format

EEPROM

Technology

EEPROM

Memory Size

256Kb (32K x 8)

Memory Interface

SPI

Clock Frequency

20MHz

Write Cycle Time - Word, Page

5ms

Access Time

-

Voltage - Supply

1.6V ~ 5.5V

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Through Hole

Package / Case

8-DIP (0.300", 7.62mm)

Supplier Device Package

8-DIP-T

BR25G256FVT-3GE2

Rohm Semiconductor

Manufacturer

Rohm Semiconductor

Series

-

Memory Type

Non-Volatile

Memory Format

EEPROM

Technology

EEPROM

Memory Size

256Kb (32K x 8)

Memory Interface

SPI

Clock Frequency

20MHz

Write Cycle Time - Word, Page

5ms

Access Time

-

Voltage - Supply

1.6V ~ 5.5V

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

8-TSSOP (0.173", 4.40mm Width)

Supplier Device Package

8-TSSOP-B

BR25G256FJ-3GE2

Rohm Semiconductor

Manufacturer

Rohm Semiconductor

Series

-

Memory Type

Non-Volatile

Memory Format

EEPROM

Technology

EEPROM

Memory Size

256Kb (32K x 8)

Memory Interface

SPI

Clock Frequency

20MHz

Write Cycle Time - Word, Page

5ms

Access Time

-

Voltage - Supply

1.6V ~ 5.5V

Operating Temperature

-40°C ~ 85°C (TA)

Mounting Type

Surface Mount

Package / Case

8-SOIC (0.154", 3.90mm Width)

Supplier Device Package

8-SOP-J