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10M50DAF672C6G Datasheet

10M50DAF672C6G Cover

10M50DAF672C6G - Intel

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URL Link

Manufacturer

Intel

Series

MAX® 10

Number of LABs/CLBs

3125

Number of Logic Elements/Cells

50000

Total RAM Bits

1677312

Number of I/O

500

Number of Gates

-

Voltage - Supply

1.15V ~ 1.25V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

672-BGA

Supplier Device Package

672-FBGA (27x27)

Manufacturer

Intel

Series

MAX® 10

Number of LABs/CLBs

3125

Number of Logic Elements/Cells

50000

Total RAM Bits

1677312

Number of I/O

178

Number of Gates

-

Voltage - Supply

1.15V ~ 1.25V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

256-LBGA

Supplier Device Package

256-FBGA (17x17)

Manufacturer

Intel

Series

MAX® 10

Number of LABs/CLBs

500

Number of Logic Elements/Cells

8000

Total RAM Bits

387072

Number of I/O

56

Number of Gates

-

Voltage - Supply

1.15V ~ 1.25V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

81-UFBGA, WLCSP

Supplier Device Package

81-VBGA, WLCSP (4.5x4.4)

Manufacturer

Intel

Series

MAX® 10

Number of LABs/CLBs

3125

Number of Logic Elements/Cells

50000

Total RAM Bits

1677312

Number of I/O

500

Number of Gates

-

Voltage - Supply

1.15V ~ 1.25V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

672-BGA

Supplier Device Package

672-FBGA (27x27)

Manufacturer

Intel

Series

MAX® 10

Number of LABs/CLBs

3125

Number of Logic Elements/Cells

50000

Total RAM Bits

1677312

Number of I/O

360

Number of Gates

-

Voltage - Supply

1.15V ~ 1.25V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

484-BGA

Supplier Device Package

484-FBGA (23x23)

Manufacturer

Intel

Series

MAX® 10

Number of LABs/CLBs

3125

Number of Logic Elements/Cells

50000

Total RAM Bits

1677312

Number of I/O

178

Number of Gates

-

Voltage - Supply

1.15V ~ 1.25V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

256-LBGA

Supplier Device Package

256-FBGA (17x17)

Manufacturer

Intel

Series

MAX® 10

Number of LABs/CLBs

500

Number of Logic Elements/Cells

8000

Total RAM Bits

387072

Number of I/O

250

Number of Gates

-

Voltage - Supply

1.15V ~ 1.25V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

484-BGA

Supplier Device Package

484-FBGA (23x23)

Manufacturer

Intel

Series

MAX® 10

Number of LABs/CLBs

500

Number of Logic Elements/Cells

8000

Total RAM Bits

387072

Number of I/O

250

Number of Gates

-

Voltage - Supply

1.15V ~ 1.25V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

484-BGA

Supplier Device Package

484-FBGA (23x23)

Manufacturer

Intel

Series

MAX® 10

Number of LABs/CLBs

500

Number of Logic Elements/Cells

8000

Total RAM Bits

387072

Number of I/O

178

Number of Gates

-

Voltage - Supply

1.15V ~ 1.25V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

256-LBGA

Supplier Device Package

256-FBGA (17x17)

Manufacturer

Intel

Series

MAX® 10

Number of LABs/CLBs

500

Number of Logic Elements/Cells

8000

Total RAM Bits

387072

Number of I/O

250

Number of Gates

-

Voltage - Supply

1.15V ~ 1.25V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

484-BGA

Supplier Device Package

484-FBGA (23x23)

Manufacturer

Intel

Series

MAX® 10

Number of LABs/CLBs

250

Number of Logic Elements/Cells

4000

Total RAM Bits

193536

Number of I/O

101

Number of Gates

-

Voltage - Supply

2.85V ~ 3.465V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

144-LQFP Exposed Pad

Supplier Device Package

144-EQFP (20x20)

Manufacturer

Intel

Series

MAX® 10

Number of LABs/CLBs

250

Number of Logic Elements/Cells

4000

Total RAM Bits

193536

Number of I/O

178

Number of Gates

-

Voltage - Supply

1.15V ~ 1.25V

Mounting Type

Surface Mount

Operating Temperature

0°C ~ 85°C (TJ)

Package / Case

256-LBGA

Supplier Device Package

256-FBGA (17x17)